Titanium Sputtering Target Block

A high-purity, high-density, and uniform titanium target block is used in thin film deposition processes such as sputtering, evaporation, and ion beam deposition. Sputtering is a physical vapor deposition process in which a target material is bombarded with high-energy ions or atoms, causing atoms to be ejected from the target and deposited onto a substrate.

Sputtering is a common thin film deposition process used in the production of various electronic and optical devices. Titanium sputtering targets are widely used in the production of thin film solar cells, integrated circuits, and hard coatings on cutting tools.

Thin film solar cells require a highly efficient and uniform deposition of titanium films to ensure optimal performance. Titanium films can also be used as barrier layers to prevent diffusion of other metals in electronic devices.

In the production of integrated circuits, titanium is commonly used as a contact material due to its low resistivity and compatibility with silicon. Titanium nitride films, which can be produced by reactive sputtering of titanium targets, are also used as a hard mask and diffusion barrier in the fabrication of microelectronic devices.

Titanium films are also used as a hard coating on cutting tools to improve their wear resistance and extend their lifespan. Decorative coatings on jewelry and watches are another application of titanium thin films, which provide a durable and attractive finish.

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